Jiangsu Changjiang Electronics Technology Co Ltd

JCET Group Co Ltd is a leading provider of semiconductor packaging solutions, offering a comprehensive range of services including packaging design, product development, and certification. With a strong portfolio of technology and solutions, JCET specializes in semiconductor design, wafer probe, bumping, packaging, testing, and drop shipment services.

JCET's cutting-edge technologies include Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bumping, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA), and System-in-Package (SiP). These solutions cater to various industries including consumer electronics, automotive, telecommunications, and more.

With a focus on innovation and quality, JCET delivers reliable and cost-effective semiconductor packaging solutions that meet the evolving needs of its customers. Backed by extensive intellectual property rights and state-of-the-art facilities, JCET ensures high-performance and high-reliability packaging solutions for semiconductor manufacturers worldwide. Explore JCET's diverse portfolio of packaging technologies to discover how they can drive the success of your semiconductor products across different industries.