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EPCOS B82498F3681J

Ind Chip Molded Wirewound 680nH 5% 25MHz 23Q-Factor Ceramic 190mA 0805 Blister T/R

Product Details

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Compliance

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Ratings
AEC-Q200
REACH SVHC
No SVHC
RoHS
Compliant

Dimensions

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Depth
1.7 Ω
Height
1.4 mm
Height - Seated (Max)
1.397 mm
Length
5 %
Max Length
2.3 mm
Max Width
150 °C
Width
1.2 mm

Physical

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Case Code (Imperial)
0805
Case Code (Metric)
2012
Case/Package
0805
Core Material
Ceramic
Mount
-55 °C
Number of Pins
2
Weight
IBS

Supply Chain

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Lifecycle Status
Production

Technical

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Composition
Wirewound
Current Rating
190 mA
DC Current
190 mA
DC Resistance (DCR)
1.7 Ω
Inductance
680 nH
Inductance Tolerance
5%
Max DC Current
190 mA
Max Frequency
50 Hz
Max Operating Temperature
150 °C
Military Standard
Not
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
5415495
Resistance
1.7 Ω
Self Resonant Frequency
300 MHz
Shielding
Unshielded
Termination
8504500000, 8504500000|8504500000|8504500000|8504500000|8504500000
Test Frequency
25 MHz
Tolerance
5 %

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