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NXP Semiconductors BAP65-02,135
Product Details
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Compliance
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RoHS
Compliant
Physical
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Contact Plating
Tin
Mount
-40 °C
Number of Pins
2
Technical
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Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
900 mV
Max Current Rating
100 mA
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Min Operating Temperature
-40 °C
Packaging
Tape and Reel
Peak Reverse Current
20 nA
Power Dissipation
715 mW
Reverse Voltage
30 V
Termination
Solder