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NXP Semiconductors BGA2870,115
Product Details
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Compliance
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Radiation Hardening
200 mW
RoHS
Compliant
Physical
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Case/Package
TSSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
6
Technical
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Frequency
0 Hz
Gain
31 dB
Max Frequency
750 MHz
Max Operating Temperature
125 °C
Max Power Dissipation
200 mW
Max Supply Voltage
2.7 V
Min Operating Temperature
-40 °C
Min Supply Voltage
2.3 V
Noise Figure
3.7 dB
Nominal Supply Current
16 mA
Number of Channels
1
Operating Supply Current
16 mA
Operating Supply Voltage
2.5 V
P1dB
4 dBm
Packaging
Digi-Reel®
Power Dissipation
Digi-Reel®
Test Frequency
2.15 GHz