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NXP Semiconductors LPC2364FBD100
Product Details
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Compliance
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REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1.45 mm
Length
14.1 mm
Width
14.1 mm
Physical
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Case/Package
LQFP
Mount
Surface Mount
Number of Pins
100
Technical
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Core Architecture
ARM
Density
1 Mb
Frequency
72 MHz
Interface
CAN, I2C, I2S, SPI, UART, USB
Max Frequency
72 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
128 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
3 V
Number of ADC Channels
6
Number of Ethernet Channels
1
Number of I/Os
70
Number of I2C Channels
3
Number of PWM Channels
6
Number of SPI Channels
3
Number of Timers/Counters
4
Number of UART Channels
4
Peripherals
DMA, PWM
RAM Size
8 kB
Termination
SMD/SMT