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NXP Semiconductors MC68F375BGMZP33
Product Details
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Compliance
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Halogen Free
Not Halogen Free
Lead Free
Contains Lead
Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
BGA
Mount
Surface Mount
Number of Pins
217
Weight
2.168342 g
Technical
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Core Architecture
Coldfire
Data Bus Width
32 b
Frequency
33 MHz
Interface
CAN, SCI, SPI, UART, USART
Max Frequency
16 MHz
Max Operating Temperature
125 °C
Max Power Dissipation
125 °C
Max Supply Voltage
5 V
Memory Size
256 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of I/Os
48
Number of Programmable I/O
48
Number of Timers/Counters
16
Oscillator Type
Internal
Peripherals
POR, PWM, WDT
RAM Size
10 kB