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NXP Semiconductors MCIMX31LDVKN5DR2
Product Details
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Compliance
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Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
BGA
Mount
Surface Mount
Number of Pins
457
Weight
424.108866 mg
Technical
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Core Architecture
ARM
Data Bus Width
32 b
Frequency
532 MHz
Max Operating Temperature
70 °C
Memory Type
L2 Cache, ROM, SRAM
Min Operating Temperature
-20 °C
Number of Cores
1
Operating Supply Voltage
1.65 V
Packaging
Tape & Reel (TR)