.png){kind=logo}
Winbond W25Q80BVSSIG
Product Details
Find similar products
Compliance
Select to search
related specs
related specs
Radiation Hardening
No
RoHS
Compliant
Dimensions
Select to search
related specs
related specs
Height
2.16 mm
Physical
Select to search
related specs
related specs
Case/Package
SOIC
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
8
Technical
Select to search
related specs
related specs
Access Time
8.5 ns
Address Bus Width
1 b
Ambient Temperature Range High
85 °C
Density
8 Mb
Frequency
104 MHz
Interface
SPI
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
1 MB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.5 V
Nominal Supply Current
18 mA
Operating Supply Voltage
3.3 V
Page Size
256 B
Sync/Async
Asynchronous
Word Size
8 b