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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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12.6.2023
Dutch Government Approves Chinese-Owned Nexperia's Acquisition of Dutch Startup Nowi
The Dutch government has approved the acquisition of Dutch startup Nowi by Chinese-owned Nexperia. The deal was initially approved in 2022, but the government conducted a retroactive review out of concern for foreign takeovers of sensitive technologies. Nowi develops chips that use ambient sources of electricity to power electronic devices, and Nexperia is a global leader in essential semiconductors. The government's approval signals a balancing act between promoting economic growth through foreign investment and safeguarding national security interests.
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12.6.2023
The price of photomasks will rise in 2024 due to Global Shortage
The semiconductor photomask market is booming with prices expected to rise in 2024, as demand from Chinese chip manufacturers and wafer foundries remains strong. Photomask manufacturers are running at full capacity and some Chinese chip companies are willing to pay extra for shorter delivery times.
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12.5.2023
South Korea's 8-inch wafer foundry begins to reduce prices by as much as 10%
The global semiconductor industry is facing several challenges, including slowing consumer demand, excess capacity, and rising costs. In response, wafer foundries, such as TSMC, UMC, and Samsung Electronics, are cutting prices and offering diversified profit-sharing models to attract customers. This is putting pressure on South Korean wafer foundries, which are already facing competition from their Chinese counterparts.
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12.4.2023
USPTO Streamlines Patent Review for Semiconductor Technologies
The U.S. Patent & Trademark Office (USPTO) has launched the Semiconductor Technology Pilot Program, designed to fast-track patent applications related to semiconductor device manufacturing. With prioritizing semiconductor patent applications, the USPTO aims to reduce U.S. dependence on foreign semiconductor chip supplies while propelling domestic innovation.
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12.4.2023
Michigan Completes Installation of Nation's First Wireless-Charging Public Roadway
The Michigan Department of Transportation (MDOT) and partners have completed the installation of the nation's first wireless-charging public roadway in Detroit. The roadway is equipped with inductive-charging coils that will charge electric vehicles (EVs) with Electreon receivers as they drive on the road. This is a breakthrough for EVs, as it eliminates range anxiety, one of the biggest barriers to EV adoption. The Michigan pilot project is funded by a $2 million grant from the U.S. Department of Transportation (DOT). The roadway is expected to be operational in early 2024.
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12.4.2023
ETSI Establishes Industry Group to Define and Evaluate 6G Use Cases and Sensing Types
The European Telecommunications Standards Institute (ETSI) has taken a significant step towards the development of 6G technology by launching the Industry Specification Group for Integrated Sensing and Communications (ISG ISAC). The group's primary objective is to identify and prioritize a set of 6G use cases and sensing types, along with establishing a roadmap for their thorough analysis and evaluation.
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12.3.2023
Geely and NIO Partner on Battery Swapping in Hangzhou
Geely and NIO have formed a strategic partnership to promote battery swapping technology in China. The two companies will collaborate on battery standards, technology, network expansion, swappable model development, and asset management.
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12.2.2023
Global Smartphone Shipments Expected to Decline in 2023, but Foldables See Rising Demand
Despite a projected 5% decline in global smartphone shipments this year, reaching the lowest level in a decade, the market is showing signs of resilience in certain regions and segments. South Africa's smartphone market surged 73% year-over-year in Q3 2023, driven by expanding 5G networks and affordable devices. Foldable smartphones are also gaining traction, with 64% of high-end Chinese consumers willing to consider them for their next purchase. Smartphone shipments are projected to increase by 3% year-over-year in Q4 2023, indicating signs of recovery.
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11.28.2023
Wide-Bandgap Semiconductors Market to Surge for Electric Vehicles and Charging Infrastructure
The market for wide-bandgap (WBG) semiconductors is expected to grow significantly in the coming years, driven by their use in electric vehicles (EVs) and EV charging equipment. WBG semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), offer superior properties over traditional silicon-based semiconductors, making them ideal for EV applications and contributing to a more sustainable future of transportation.
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11.28.2023
U.S. Government Invests $3 Billion in Advanced Packaging Manufacturing
The U.S. government is investing $3 billion in the National Advanced Packaging Manufacturing Program (NAPMP) to help U.S. manufacturers adopt new technology and create a sustainable, profitable, and environmentally sound high-volume advanced packaging industry in the country. These programs are part of a larger effort by the U.S. government to strengthen the domestic semiconductor industry and reduce reliance on foreign manufacturing.
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